1. Assembles microelectronic semiconductor devices, components, and subassemblies according to drawings and specifications, using microscope, bonding machines, and handtools, performing any combination of following duties: Reads work orders and studies assembly drawings to determine operation to be performed. 2. Observes processed semiconductor wafer under scribing machine microscope and aligns scribing tool with markings on wafer. 3. Adjusts scribing machine controls, according to work order specifications, and presses switch to start scribing. 4. Removes scribed wafer and breaks wafer into dice, using probe. 5. Places dice under microscope, visually examines dice for defects, according to procedures, and rejects defective dice. 6. Positions mounting device on holder under bonding machine microscope, and adjusts bonding machine controls according to work order specifications. 7. Positions die on mounting surface according to diagram. 8. Presses switch on bonding machine to bond die to mounting surface. 9. Places mounted die into holding fixture under microscope of lead bonding machine. 10. Adjusts bonding machine controls according to work order specifications. 11. Views die and moves controls to align and position bonding head for lead bonding according to diagram. 12. Presses switch to bond lead and moves bonding head to points indicated in bonding diagram to attach and route leads as illustrated. 13. Inserts and seals unprotected assembly into designated assembly container device, using welding machine and epoxy syringe, to protect microelectronic assembly and complete device, component, or subassembly package. 14. Examines and tests assembly at various stages of production, using microscope, go-not-go test equipment, measuring instruments, pressure-vacuum tanks, and related devices, according to standard procedures, to detect nonstandard or defective assemblies. 15. Rejects or routes nonstandard components for rework. 16. Cleans parts and assemblies at various stages of production, using cleaning devices and equipment. 17. Maintains records of production and defects. 18. Bonds multiple dice to headers or other mounting devices. 19. Important variations are kinds of equipment used, such as thermal compression, wedge, wire ball, and wobble bonders, items assembled, or procedure performed.
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